JUKI 3D solder mametaka milina fisafoana RV-2
| Anarana modely | RV-2 | ||
| Ny haben'ny PWB | 50mm × 50mm - 410mm × 360mm 630mm × 360mm (PWB lava kokoa)* | ||
| singa | 0402* / 0603(metrika), Cylindrical chip, tantalum capacitor, transistor, SOP / QFP, sns. | ||
| FOV (tsara indrindra) | 2D | 0.2s / frame | |
| i-3D SPI | 2D+3D FANDINIHANA | 0.50s / frame (4 frame) | |
| e-3D AOI | 2D+3D FANDINIHANA | 0,55s / frame (4 frame) | |
| Famahana ny fisafoana | 15μm (Resloution manara-penitra), 10μm (fanapahan-kevitra avo)* | ||
| Zavatra fisavana | Singa tsy hita, Fifindran'ny toerana, Polarity, Fihodinana eo anoloana/vohoka, Tsy misy solder, Tetezana, Habetsan'ny solder, Tsy fahampian'ny singa fampidirana, Famantarana ny toetra* | ||
